LGA 1851 (codename Socket V1) is a land grid array CPU socket designed by Intel for Meteor Lake-PS embedded and Arrow Lake-S desktop processors, released on October 24, 2024.
The number of contacts has increased, from 1700 (for LGA 1700) to 1851. It uses the same dimensions and cooler mounting hole spacing as LGA 1700, ensuring continued CPU cooler compatibility.
It offers 20 PCIe 5.0 lanes (x16 for the expansion cards and x4 for storage) and an additional 4 PCIe 4.0 lanes for storage. The available PCIe lanes for the expansion cards can now be bifurcated to three devices (x8, x4, x4) instead of two, in case of LGA 1700. Similar to AMD's AM5 socket, LGA 1851 only supports DDR5 SDRAM, dropping support for DDR4 and marking the end of mainstream DDR4 after 10 years.
However, Intel is reportedly planning to release a refresh of LGA 1700 compatible CPUs supporting DDR4 in the first or second quarter of 2027. Intel is believed to be doing this as a result of the current supply shortages with newer DDR5 memory.https://www.tomshardware.com/pc-components/cpus/intel-reportedly-preparing-surprise-return-to-ddr4-systems-with-raptor-lake-next-ddr4-platform-slated-for-the-first-half-of-2027-on-the-lga-1700-socket-takes-a-page-from-amds-book-by-extending-budget-platform-longevity Arrow Lake chipsets (800 series)
H810 B860 Q870 W880 Z890 Overclocking Bus Interface DMI 4.0 ×4 DMI 4.0 ×8 CPU supportArrow Lake Memory capacity Up to 128 GB Up to 256 GB Maximum DIMM slots 24 ECC memory colspan="3" colspan="1" Maximum USB 2.0 ports 10 12 14 USB 3.2 ports configuration Up to 4 Up to 6 Up to 10 Gen 2 Up to 2 Up to 4 Up to 8 Up to 10 Up to 2 Up to 4 Up to 5 Maximum SATA 3.0 ports 4 8 Processor PCI Express configuration 5.0 1×16 1×16 or 2×8 or 1×8+2×4 5.0(for M.2) 1x4 4.0(for M.2) 1x4 PCH PCI Express configuration 4.0 8 14 20 24 3.0 colspan="5" Independent display support (digital ports/pipes) 3 4 Integrated wireless colspan="5" PCIe RAID support colspan="2" colspan="3" SATA RAID support colspan="4" Intel Optane memory support colspan="5" Intel Smart Sound technology colspan="5" Intel Active Management, Trusted Execution and vPro technology colspan="2" colspan="2" Chipset TDP6 W Release dateQ1 2025 Q4 2024
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