COM-HPC is a computer-on-module form factor standard that targets high performance compute and high I/O levels. Each COM-HPC module integrates core CPU and memory functionality and input and output including USB up to Gen 4, audio (MIPI SoundWire, I2S and DMIC), graphics, (PCI Express) up to Gen. 5, and Ethernet up to 25 Gbit/s per lane. All I/O signals are mapped to two high density, high speed and low profile connectors on the bottom side of the module. COM-HPC employs a mezzanine-based approach. The COM modules plug into a carrier or base board that is typically customized to the application. Over time, the COM-HPC mezzanine modules can be upgraded to newer, backwards-compatible versions. COM-HPC targets Industrial, Military/Aerospace, Gaming, Medical, Transportation, IoT, and General Computing embedded applications and even scales up to RAM and performance hungry server or edge server applications.
History The PICMG work-group officially started in October 23, 2018. Rev. 1.00 Release date: Feb 19, 2021 Rev. 1.10 added HD Audio as alternative for SoundWire, functional safetey signals and a second 5V standby power pin. Release date: Jan 21, 2022 Rev. 1.20 added definition for the Mini. Release date: Oct. 3, 2023 Rev. 1.30 work started June 25, 2024. Major topics for the workgroup are: Signal integrity for PCIe Gen 6 Modern Standby S0ix CXL
Types There are 3 different pin outs defined in the specification. +Summary of COM-HPC IOs by Pinout TypeIO TypeClient PinoutServer PinoutMini PinoutPCIe49 (1 BMC dedicated lane)65 (1 BMC dedicated lane)16 (shared with 2xSATA and 2x ETH Serdes)Ethernet2x NbaseT1x NbaseT2x NbaseT + 2x Serdes (shared with PCIe)25 Gigabit Ethernet KR280USB4 (Can also be used for USB 3.x or USB 2.0)424 (shared with DDI & USB3.2)USB 2.0888DDI (Digital Display Interface for HDMI or DisplayPort)302 (shared with USB4 and USB3.2)eDP or MIPI DSI (for flat panel displays)101MIPI SoundWire or DMIC202I2S or MIPI SoundWire1 I2S (or 2 Soundwire)01 I2S (or 2 Soundwire)MIPI CSI-3 (CSI-2 also supported)202 on flatfoil connectorSATA222 shared with PCIeGPIO121212UART222IPMB110eSPI (includes 2 Chip Select Pins)111SPI (for boot devices)222GP_SPI (includes 4 Chip Select Pins)111I2C222SMB111DC Power Input8-20 Volt12 Volt +/- 5%8-20 Volt
Size The specification defines 6 module sizes: Size Mini: The sizes A, B and C are typical Client Type sizes. Size A: Size B: Size C: The larger D and E sizes are typical Server Type sizes to support full size DRAM modules Size D: Size E:
Specification The COM-HPC specification is hosted by PICMG. It is not freely available but may be purchased from the PICMG website. PICMG provides a preview version for free download. The COM-HPC hardware specification will be released Jan 2021. Further COM-HPC related documents will be released in 2021 Carrier Board Design Guide for Ethernet KR Full Carrier Board Design Guide Platform Management Specification Embedded EEPROM Specification (EEEP)
See also ETX XTX Qseven SMARC COM Express
References
External links
COM-HPC Overview PICMG COM-HPC Overview ADLINK COM-HPC Overview congatec COM-HPC Overview Kontron COM-HPC Overview Samtec COM-HPC Overview Advantech COM-HPC Overview Avnet COM-HPC Overview Comtel COM-HPC Overview Eurotech COM-HPC Overview Seco COM-HPC Overview Trenz