Microprocessors of the Ryzen brand are a line of x86-64 microprocessors manufactured by AMD, based on the Zen microarchitecture. Ryzen microprocessors include: Ryzen 3, Ryzen 5, Ryzen 7, Ryzen 9, and Ryzen Threadripper (with up to 96 cores). All consumer desktop Ryzens (except PRO models), as well as all mobile processors with the HX suffix, have an unlocked multiplier. In addition, all Ryzen microprocessors support Simultaneous Multithreading (SMT), except for earlier Zen/Zen+ based desktop and mobile Ryzen 3 processors, and some models of the Zen 2 mobile Ryzen microprocessor.
Desktop processors Ryzen 1000 series Summit Ridge (1000 series, Zen based)
Whitehaven (Threadripper 1000 series, Zen based)
Ryzen 2000 series Raven Ridge (2000 series with Radeon Graphics, Zen/GCN5 based)
Pinnacle Ridge (2000 series, Zen+ based)
Colfax (Threadripper 2000 series, Zen+ based)
Ryzen 3000 series Picasso (3000 series with Radeon Graphics, Zen+/GCN5 based)
Matisse (3000 series, Zen 2 based)
Castle Peak (Threadripper 3000 series, Zen 2 based)
Ryzen 4000 series Renoir (4000 series, Zen 2 based) Based on the Ryzen 4000G series APUs with the integrated GPU disabled.
Renoir (4000 series with Radeon Graphics, Zen 2/GCN5.1 based)
Ryzen 5000 series Vermeer (5000 series, Zen 3 based)
Cezanne (5000 series, Zen 3 based) Cézanne based CPUs that have the integrated GPU disabled.
Cezanne (5000 series with Radeon Graphics, Zen 3/GCN5.1 based)
Chagall (Threadripper 5000 series, Zen 3 based)
Ryzen 7000 series Raphael (7000 series, Zen 4/RDNA2 based)
Storm Peak (Threadripper 7000 series, Zen 4 based)
Ryzen 8000 series Phoenix (8000 series, Zen 4 based)
Phoenix (8000 series with Radeon Graphics, Zen 4/RDNA3/XDNA based)
Ryzen 9000 series Granite Ridge (9000 series, Zen 5/RDNA2 based)
Shimada Peak (Threadripper 9000 series, Zen 5 based)
Ryzen AI 400 series Gorgon Point AM5 (AI 400 Series, Zen 5/RDNA3.5/XDNA2 based)
Mobile processors Ryzen 2000 series Raven Ridge (Zen/GCN5 based)
Ryzen 3000 series Dalí (Zen/GCN5 based)
Picasso (Zen+/GCN5 based)
Ryzen 4000 series Renoir (Zen 2/GCN5 based)
Ryzen 5000 series Lucienne (Zen 2/GCN5 based)
Cezanne and Barceló (Zen 3/GCN5 based) Cezanne (2021 models), Barceló (2022 models).
Ryzen 6000 series Rembrandt (Zen 3+/RDNA2 based)
Ryzen 7000 series Mendocino (7020 series, Zen 2/RDNA2 based)
Barcelo-R (7030 series, Zen 3/GCN5 based)
Rembrandt-R (7035 series, Zen 3+/RDNA2 based)
Phoenix (7040 series, Zen 4/RDNA3/XDNA based)
Dragon Range (7045 series, Zen 4/RDNA2 based)
Ryzen 8000 series Hawk Point (8040 series, Zen 4/RDNA3/XDNA based)
Dragon Range Refresh (8045 series, Zen4/RDNA2 based)
Ryzen 9000 series Fire Range (Zen 5/RDNA2 based) Common features of Ryzen 9000 Fire Range series:
Socket: FL1 All Models support DDR5-5600 in 128-bit mode; Maximum memory: 96 GB All models support 28 PCIe 5.0 lanes Native USB 10Gbps (USB 3.2 Gen 2 operation mode) : 4 Native USB 2.0 (480 Mbit/s): 1 iGPU: AMD Radeon 610M (2 CU @ 2200 MHz) No NPU L1 cache: 80 KB (48 KB data + 32 KB instruction) per core L2 cache: 1 MB per core Fabrication process: TSMC N4 FinFET (CCD) + TSMC N6 FinFET (I/OD)
Branding and Model Cores (threads) Clock (GHz) L3 cache(total) Chiplets Core config TDP Release date Base Boost Ryzen 9 9955HX3D 16 (32) 2.3 5.4 128 MB 2 × CCD1 × I/OD 2 × 8 55–75W 1H 2025 9955HX 2.5 64 MB 9850HX 12 (24) 3.0 5.2 2 × 6 45–75W
Ryzen 10 series Mendocino (10 series, Zen 2/RDNA2 based)
Ryzen 100 series Rembrandt-R (100 series, Zen 3+/RDNA2 based)
Hawk Point Refresh (100 series, Zen 4/RDNA3/XDNA based)
Ryzen 200 series Hawk Point Refresh (200 series, Zen 4/RDNA3/XDNA based)
Branding and Model CPU GPUNPU (Ryzen AI) TDP () Release date Cores (threads) Clock (GHz) L3 cache(total) Core config Model Clock(GHz) Total Zen 4 Zen 4c Base Boost Ryzen 9 270 8 (16) 8 (16) - 4.0 5.2 16 MB 1 × 8 780M12 CU 2.8Yes 16 TOPS45 W (35−54 W) February 18, 2025 Ryzen 7 260 3.8 5.1 2.7(PRO)2533.64.92.5June 2, 2026 (PRO)250 3.35.12.7 28 W (15−30 W)(March 27, 2025) February 18, 2025(PRO)2493.14.92.5June 2, 2026(PRO)2176 (12)2 (4)4 (8)3.04.82 + 4740M4 CU2.6No35 W (15−40 W) Ryzen 5 240 6 (12) - 4.3 5.0 1 × 6 760M8 CUYes 16 TOPS 45 W (35−54 W)(March 27, 2025) February 18, 2025 (PRO)230 3.5 4.9 28 W (15−30 W)(PRO)225(3.3) 4.14.82.445 W (35−54 W)June 2, 2026(PRO)2243.328 W (15−30 W) (PRO)220 2 (4) 4 (8) 3.7 / 3.0 4.9 / 3.5 2 + 4 740M4 CU 2.8No(March 27, 2025) February 18, 2025(PRO)2162.94.72.535 W (15−40 W)June 2, 2026PRO 2153.2 / 3.24.7 / 3.552.728 W (15−30 W)March 27, 2025 Ryzen 3 (PRO)210 4 (8) 1 (2) 3 (6) 3.6 / 2.8 4.7 / 3.3 8 MB 1 + 3 2.5(March 27, 2025) February 18, 2025(PRO)2052.84.62.328 W (15−40 W)June 2, 2026
Ryzen AI 300 series Strix Point and Krackan Point (Zen 5/RDNA3.5/XDNA2 based)
Strix Halo (Zen 5/RDNA3.5/XDNA2 based) Common features of Strix Halo mobile CPUs: Socket: BGA, FP11 package type. All CPUs only support soldered LPDDR5X memory with a 256-bit memory bus. All CPUs support 16 lanes of PCIe 4.0 lanes. iGPU uses the RDNA 3.5 architecture. Fabrication process: TSMC N4P FinFET. Branding and Model CPU GPU Memory NPU(Ryzen AI) Chiplets Coreconfig TDP Release date Cores(threads) Clock (GHz) L3 cache(total) Model Clock(GHz) Bus type& width(Max memory) Clock(MT/s) Bandwidth(GB/s) Base Boost Ryzen AI MAX+ (PRO)395 16 (32) 3.0 5.1 64 MB 8060S40 CUs 2.9 LPDDR5X256-bit(128 GB) Up to 8000 Up to 256 50 TOPS 2 × CCD1 × I/OD with GPU 2 × 8 45–120 W Q1 2025 392 12 (24) 3.2 5.0 2 × 6 Q1 2026 Ryzen AI MAX (PRO)390 8050S32 CUs 2.8 Q1 2025 Ryzen AI MAX+ 388 8 (16) 3.6 32 MB 8060S40 CUs 2.9 1 × CCD1 × I/OD with GPU 1 × 8 Q1 2026 Ryzen AI MAX (PRO)385 8050S32 CUs 2.8 Q1 2025 PRO 380 6 (12) 4.9 16 MB 8040S16 CUs LPDDR5X128-bit(64 GB) Up to 128 1 × 6
Ryzen AI 400 series Gorgon Point (Zen 5/RDNA3.5/XDNA2 based)
Gorgon Halo (Zen 5/RDNA3.5/XDNA2 based)
Handheld gaming PC processors Ryzen Z1 series (Zen 4/RDNA3 based)
Ryzen Z2 series (multiple architectures)
Embedded processors 1000 series Great Horned Owl (V1000 series, Zen/GCN5 based)
Banded Kestrel (R1000 series, Zen/GCN5 based)
2000 series Grey Hawk (V2000 series, Zen 2/GCN5 based)
River Hawk (R2000 series, Zen+ based)
3000 series (V3000 series, Zen 3 based)
5000 series (Ryzen Embedded 5000 series, Zen 3 based)
7000 series (Ryzen Embedded 7000 series, Zen 4/RDNA2 based)
P100 series (Ryzen AI Embedded P100 series, Zen 5/RDNA 3.5 based)
Model numbers with the "i" suffix are marketed for industrial use and support operating at colder ambient temperatures. Model numbers with the "a" suffix are marketed for automotive use and are AEC-Q100 qualified for reliability and longevity.
Common features of Ryzen AI Embedded P100 series CPUs: Socket: BGA, FP8 package type. L3 cache (total): 8 MB. All models support dual-channel ECC DRAM. All models support 14 PCIe 4.0 lanes. Native 10GbE ports (with TSN): 2 Native USB 5Gbps (USB 3.2 Gen 1 operation mode): 1 Native USB 5Gbps (USB 3.1 Gen 1 operation mode): 1 Native USB 2.0 (480 Mbit/s): 4 iGPU uses the RDNA 3.5 microarchitecture and supports output at up to 120 FPS to up to either 4 × 4K or 2 × 8K displays. iGPU supports encoding/decoding video at up to 4K & 60 Hz. All iGPUs support HDMI 2.1 and DisplayPort 2.0 output. NPU uses the XDNA 2 architecture. Rated longevity: "2.5 years (Standard), Up to 10 years (Extended)"
Processorbranding Model CPU GPU Memorysupport NPU USB4ports NominalTDP ConfigurableTDP Junctiontemperaturerange Releasedate Cores(threads) Boost clock(GHz) L2 cache(total) Clock(GHz) eDPversion Ryzen AIEmbedded P132i 6 (12) 4.5 6 MB 4 2.8 1.4 LPDDR5X-8000DDR5-5600 50 2 28 W 15–54 W −40°C105°C Q2 2026 P132 0°C105°CP132a 3.7 4 MB 2.4 1.5 LPDDR5X-7500with RAS 45 W 25–45 W −40°C105°C P121i 4 (8) 4.4 4 MB 2 2.7 1.4 LPDDR5X-7500DDR5-5600 30 2 28 W 15–54 W −40°C105°C P121 0°C105°CP122a 3.7 4 2.0 1.6 LPDDR5X-7500with RAS 15–30 W −40°C105°C
See also Table of AMD processors List of AMD Athlon processors List of AMD processors with 3D graphics List of AMD CPU microarchitectures List of AMD chipsets
References