LGA 1150, also known as Socket H3, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for CPUs built on the Haswell and Broadwell microarchitectures. It was first released on June 2, 2013.

It is the successor of LGA 1155 and was itself succeeded by LGA 1151 in 2015.

Most motherboards with the LGA 1150 socket support varying video outputs (DisplayPort, VGA, DVI or HDMI depending on the model) and Intel Clear Video Technology.

Full support of Windows on LGA 1150 platform starts on Windows 7. Official Windows XP support is limited to selected CPUs, chipsets and only for embedded and industrial systems.

Intel's Platform Controller Hub (PCH) for the LGA 1150 CPUs is codenamed Lynx Point. Intel Xeon processors for socket LGA 1150 use the Intel C222, C224, and C226 chipsets.

Heatsink The four holes for fastening the heatsink to the motherboard are placed in a square with a lateral length of 75mm for Intel's sockets LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1200. Cooling solutions should therefore be interchangeable.

Haswell chipsets

First generation

PCH name H81 C222 B85 C224 Q85 Q87 C226 H87 Z87 Overclocking CPU ratio (ASRock, ECS, Biostar, Gigabyte, Asus, MSI) + GPU Haswell Refresh CPUs support colspan="9" (may require BIOS update before CPU installation) Broadwell CPUs support (may require BIOS update before CPU installation) (may require BIOS update before CPU installation) colspan="2" (may require BIOS update before CPU installation) colspan="2" Allows using built-in GPU colspan="5" Maximum DIMM slots 4 (Up to 32 GB supported) Maximum USB ports 2.0 8 10 8 3.0 2 4 6 Maximum SATA ports 2.0 2 4 2 0 3.0 2 4 6 CPU-attached PCI Express 1 × PCIe 2.0 ×16 Either 1 × PCIe 3.0 ×16, 2 × PCIe 3.0 ×8, or 1 × PCIe 3.0 ×8 and 2 × PCIe 3.0 ×4 1 × PCIe 3.0 ×16 Either 1 × PCIe 3.0 ×16, 2 × PCIe 3.0 ×8, or 1 × PCIe 3.0 ×8 and 2 × PCIe 3.0 ×4 1 × PCIe 3.0 ×16 Either 1 × PCIe 3.0 ×16, 2 × PCIe 3.0 ×8, or 1 × PCIe 3.0 ×8 and 2 × PCIe 3.0 ×4 1 × PCIe 3.0 ×16 Either 1 × PCIe 3.0 ×16, 2 × PCIe 3.0 ×8, or 1 × PCIe 3.0 ×8 and 2 × PCIe 3.0 ×4 Chipset-attached PCI Express 6 × PCIe 2.0 ×1 8 × PCIe 2.0 ×1 Conventional PCI support colspan="9" Intel Rapid Storage Technology (RAID) colspan="2" Smart Response Technology colspan="5" colspan="4" Intel Anti-Theft Technology colspan="9" Intel Active Management, Trusted Execution, VT-d Technologies and Intel vPro Platform Eligibility colspan="2" , but ASRock Z87 Extreme6 supports VT-d Release date August–September 2013 June 2, 2013 Chipset TDP 4.1 W Chipset lithography 32 nm

Second generation On May 12, 2014, Intel announced the release of two 9-series chipsets, H97 and Z97. Differences and new features of these two chipsets, compared to their H87 and Z87 counterparts, are the following:

Support for Haswell Refresh CPUs out of the box Support for the fifth generation of Intel Core CPUs, built around the Broadwell microarchitecture Support for SATA Express, M.2 and Thunderbolt, though only if implemented by the motherboard's manufacturer Two of the six SATA ports can be converted to two PCIe lanes and used to provide M.2 or SATA Express connectivity. Intel refers to this variable configuration as Flex I/O or Flexible I/O.

Motherboards based on H97 and Z97 chipsets were available for purchase the same day chipsets were announced.

PCH name H97 Z97 Overclocking CPU + GPU CPU + GPU + RAM Haswell Refresh CPUs support colspan="2" Broadwell CPUs support colspan="2" Maximum DIMM slots 4 Maximum USB 2.0/3.0 ports 8 / 6 Maximum SATA 2.0/3.0 ports 0 / 6 CPU-attached PCI Express 1 × PCIe 3.0 ×16 Either 1 × PCIe 3.0 ×16, 2 × PCIe 3.0 ×8, or 1 × PCIe 3.0 ×8 and 2 × PCIe 3.0 ×4 Chipset-attached PCI Express 8 × PCIe 2.0 ×1 Conventional PCI support colspan="2" Intel Rapid Storage Technology (RAID) colspan="2" Smart Response Technology colspan="2" Intel Anti-Theft Technology colspan="2" Intel Active Management, Trusted Execution, VT-d and vPro Technology colspan="2" Release date May 12, 2014 Chipset TDP 4.1 W Chipset lithography 22 nmAnother chipset in the same series (Intel 9 series chipsets) is 22 nm:

See also List of Intel chipsets List of Intel microprocessors

Notes

References