The IEEE Electronics Packaging Award, formerly called the IEEE Components, Packaging, and Manufacturing Technologies Award, is a Technical Field Award established by the IEEE Board of Directors in 2002. It is awarded for meritorious contribution to the advancement of components, electronic packaging or manufacturing technologies.
The award may be presented to an individual or a team of up to three recipients.
Recipients of this award receive a bronze medal, certificate and an honorarium.
Recipients
Recipients of the award for each year include:
2026: Shi-Wei Ricky Lee 2025: Jie Xue 2024: Madhavan Swaminathan 2023: GuoQi (Kouchi) Zhang 2022: Douglas C.H. Yu 2021: Chin C. Lee 2020: Mitsumasa Koyanagi and Peter Ramm 2019: Ephraim Suhir 2018: William Chen 2017: Paul S. Ho and King-Ning Tu 2016: Michael Pecht 2015: Nasser Borozorg-Grayeli 2014: Avram Bar-Cohen 2013: John H. Lau 2012: Mauro WalkerMauro J. Walker, Driver of Microelectronics Production Advancements, to Receive 2012 IEEE Components, Packaging and Manufacturing Technology Award, IEEE Press release 2011: Rao R. TummalaRao Tummala to Receive IEEE CPMT Award, Georgia Inst. Technology, July 23, 2010. Rao R. Tummala, Microelectronics Packaging Trailblazer, to Receive 2011 IEEE Components Packaging and Manufacturing Technology Award, TMCnet.com, May 19, 2011. 2010: Herbert ReichlIEEE Components, Packaging & Manufacturing Technology Award 2010, Fraunhofer IZM, July 2009.Herbert Reichl awarded IEEE CPMT field award for 2010, ElectroIQ, June 10, 2010. 2009: George G. HarmanHarman Receives IEEE Award for Wire Bonding Improvements, ElectroIQ, May 13, 2009. 2008: Karl Puttlitz and Paul A. Totta 2007: Dimitry Grabbe 2006: C. P. WongC. P. Wong, Regent's Professor, Georgia Inst. Technology 2005: Yutaka Tsukada 2004: John W. Balde
References
External links Information on the award at IEEE