The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices. For this standard, the term "devices" includes monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices.
The process of qualifying devices to this standard are conducted using both nondestructive testing and destructive testing. For tests that would destroy or damage the component a representative number from a batch are tested to indicate the performance of other devices from the same batch. Tests are also carried out during the manufacturing process. Due to the testing requirements it is not possible to retrospectively qualify devices to the full MIL-STD-883 standard once they have been released by the manufacturer.
The standard was issued by the Department of Defense, US.
Environmental tests, methods 1001-1034 1001 Barometric pressure, reduced (altitude operation) 1002 Immersion 1003 Insulation resistance 1004.7 Moisture resistance 1005.8 Steady-state life 1006 Intermittent life 1007 Agree life 1008.2 Stabilization bake 1009.8 Salt atmosphere 1010.8 Temperature cycling 1011.9 Thermal shock 1012.1 Thermal characteristics 1013 Dew point 1014.13 Seal 1015.10 Burn-in test 1016.2 Life/reliability characterization tests 1017.2 Neutron irradiation 1018.6 Internal gas analysis 1019.8 Ionizing radiation (total dose) test procedure 1020.1 Dose rate induced latchup test procedure 1021.3 Dose rate upset testing of digital microcircuits 1022 Mosfet threshold voltage 1023.3 Dose rate response of linear microcircuits 1030.2 Preseal burn-in 1031 Thin film corrosion test 1032.1 Package induced soft error test procedure 1033 Endurance life test 1034.1 Dye penetrant test
Mechanical tests, methods 2001-2036 2001.2 Constant acceleration 2002.3 Mechanical shock 2003.7 Solderability 2004.5 Lead integrity 2005.2 Vibration fatigue 2006.1 Vibration noise 2007.2 Vibration, variable frequency 2008.1 Visual and mechanical 2009.9 External visual 2010.10 Internal visual (monolithic) 2011.7 Bond strength (bond pull test) 2012.7 Radiography 2013.1 Internal visual inspection for DPA 2014 Internal visual and mechanical 2015.14 Resistance to solvents 2016 Physical dimensions 2017.7 Internal visual (hybrid) 2018.3 Scanning electron microscope (SEM) inspection of metallization 2019.5 Die shear strength 2020.7 Particle impact noise detection test (PIND) 2021.3 Glassivation layer integrity 2022.2 Wetting balance solderability 2023.5 Nondestructive bond pull 2024.2 Lid torque for glass-frit-sealed packages 2025.4 Adhesion of lead finish 2026 Random vibration 2027.2 Substrate attach strength 2028.4 Pin grid package destructive lead pull test 2029 Ceramic chip carrier bond strength 2030 Ultrasonic inspection of die attach 2031.1 Flip chip pull-off test 2032.1 Visual inspection of passive elements 2035 Ultrasonic inspection of TAB bonds 2036 Resistance to soldering heat
Electrical tests (digital), methods 3001-3024 3001.1 Drive source, dynamic 3002.1 Load conditions 3003.1 Delay measurements 3004.1 Transition time measurements 3005.1 Power supply current 3006.1 High level output voltage 3007.1 Low level output voltage 3008.1 Breakdown voltage, input or output 3009.1 Input current, low level 3010.1 Input current, high level 3011.1 Output short circuit current 3012.1 Terminal capacitance 3013.1 Noise margin measurements for digital microelectronic devices 3014 Functional testing 3015.8 Electrostatic discharge sensitivity classification 3016 Activation time verification 3017 Microelectronics package digital signal transmission 3018 Crosstalk measurements for digital microelectronic device packages 3019.1 Ground and power supply impedance measurements for digital microelectronics device packages 3020 High impedance (off-state) low-level output leakage current 3021 High impedance (off-state) high-level output leakage current 3022 Input clamp voltage 3023.1 Static latch-up measurements for digital CMOS microelectronic devices 3024 Simultaneous switching noise measurements for digital microelectronic devices
Electrical tests (linear), methods 4001-4007 4001.1 Input offset voltage and current and bias current 4002.1 Phase margin and slew rate measurements 4003.1 Common mode input voltage range, Common mode rejection ratio, Supply voltage rejection ratio 4004.2 Open loop performance 4005.1 Output performance 4006.1 Power gain and noise figure 4007 Automatic gain control range
Test procedures, methods 5001-5013 5001 Parameter mean value control 5002.1 Parameter distribution control 5003 Failure analysis procedures for microcircuits 5004.11 Screening procedures 5005.15 Qualification and quality conformance procedures 5006 Limit testing 5007.7 Wafer lot acceptance 5008.9 Test procedures for hybrid and multichip microcircuits 5009.1 Destructive physical analysis 5010.4 Test procedures for custom monolithic microcircuits 5011.5 Evaluation and acceptance procedures for polymeric adhesives 5012.1 Fault coverage measurement for digital microcircuits 5013 Wafer fabrication control and wafer acceptance procedures for processed GaAs wafers
References
External links MIL-STD-883 - Test method standard for microcircuits (MIL-STD-883 has no government copyrights and written with the expressed intention of being emulated and expressed exactly as-is, and as singular reference) MIL-PRF-19500 - Semiconductor Devices, General Specification For. MIL-PRF-38534 - Hybrid Microcircuits, General Specification For. MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification For. MIL-STD-1835 - Electronic Component Case Outlines.