Intel Atom is Intel's line of low-power, low-cost and low-performance x86 and x86-64 microprocessors. Atom, with codenames of Silverthorne and Diamondville, was first announced on March 2, 2008.

For nettop and netbook Atom microprocessors after Diamondville, the memory and graphics controller are moved from the northbridge to the CPU. This explains the drastically increased transistor count for post-Diamondville Atom microprocessors.

Nettop processors (small desktop)

Bonnell microarchitecture

"Diamondville" (45 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading Transistors: 47 million Die size: 25.96 mm2 (3.27 × 7.94) Package size: 22 mm × 22 mm

"Pineview" (45 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller Transistors: 123 million (single-core), 176 million (dual-core) Die size: 66 mm2 (9.56 × 6.89) (single-core), 87 mm2 (9.56 × 9.06) (dual core) Package size: 22 mm × 22 mm

Saltwell microarchitecture

"Cedarview" (32 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading (except D2500) Integrated PowerVR SGX545-based Intel GMA 3600/GMA 3650 GPU and DDR3 single-channel memory controller Package size: 22 mm × 22 mm

Netbook processors (sub-notebook)

Bonnell microarchitecture

"Diamondville" (45 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading Transistors: 47 million Die size: 26 mm2 Package size: 22 mm × 22 mm

"Pineview" (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller supporting up to 2 GB Transistors: 123 million (single-core), 176 million (dual-core) Die size: 66 mm2 (9.56 × 6.89) (single-core), 87 mm2 (9.56 × 9.06) (dual core) Package size: 22 mm × 22 mm

Saltwell microarchitecture

"Cedarview" (32 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading Integrated PowerVR SGX545-based Intel GMA 3600/GMA 3650 GPU and DDR3 single-channel memory controller Package size: 22 × 22 mm

MID processors/SoCs (UMPC/Smartphone/IoT)

Bonnell microarchitecture

"Silverthorne" (45 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation) Models Z520, Z520PT, Z530, Z530P, Z540, Z550 and Z560 support Intel VT-x and Hyper-Threading Model Z515 supports Intel Burst Performance Technology Uses the Poulsbo chipset. Transistors: 47 million Die size: 26 mm2 Package size: 13 mm × 14 mm / 22 mm × 22 mm (processors ending with the P or PT sSpec number)

"Lincroft" (45 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading. All except Z605 support Intel Burst Performance Technology (BPT). GMA 600 GPU and DDR2 single-channel memory controller are integrated into the processor. Transistors: 140 million Die size: 7.34 mm × 8.89 mm = 65.2526 mm2 Package size: 13.8 mm × 13.8 × 1.0 mm Steppings: C0

Saltwell microarchitecture

"Penwell" (32 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Hyper-Threading. Integrated PowerVR SGX540 GPU and DDR3 single-channel memory controller Package size: 12 mm × 12 × 1.0 mm Transistors: 140 million Die size: 65.2526 mm2 (7.34 mm x 8.89 mm)

Silvermont microarchitecture

"Merrifield" (22 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, Intel Burst Performance Technology (BPT). Z3480 also supports Intel Wireless Display. Integrated PowerVR G6400 GPU, memory controller supporting two 32-bit LPDDR3 channels up to 4 GB, USB 3.0 controller, eMMC 4.5 Paired with Intel XMM 7160 LTE modem supporting 4G/3G/2G

Package size: 12 mm × 12 × 1.0 mm

"Moorefield" (22 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, Intel Burst Performance Technology (BPT), Intel Wireless Display. GPU (PowerVR G6430) and memory controller are integrated onto the processor die Package size: 14 mm × 14 × 1.0 mm

"SoFIA" (28 nm)

SoFIA (smart or feature phone with Intel architecture) All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Intel VT-x, AES-NI (based on Silvermont's specs) GPU (ARM Mali) and memory controller are integrated onto the processor die Package size: 34 × 40 mm SoFIA 3G SoC with Silvermont CPU Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3130)Rockchip#Tablet processors with integrated modem SoFIA 3G–R SoC with Silvermont CPU Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3230RK) SoFIA LTE (W) with Airmont CPU (Announced, but never launched) Integrated LTE Cat. 4 (XG726-based), SMARTi 4.5, LnP/ CG2000, PMIC (Atom x3-C3440 & C3445)

Tablet processors/SoCs

Bonnell microarchitecture

"Lincroft" (45 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading. All except Z605 support Intel Burst Performance Technology (BPT). GMA 600 GPU and DDR2 single-channel memory controller are integrated onto the processor die Transistors: 140 million Die size: 7.34 mm × 8.89 mm = 65.2526 mm2 Package size: 13.8 mm × 13.8 × 1.0 mm Steppings: C0

Saltwell microarchitecture

"Cloverview" (32 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading, Intel Burst Performance Technology (BPT). GPU and memory controller are integrated onto the processor die Package size: 13.8 mm × 13.8 × 1.0 mm Steppings:B1, C0

No official TDP available. For power data seeData sheet Intel page 129–130.

Silvermont microarchitecture

"Bay Trail-T" (22 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Intel VT-x, AES-NI, TXT/TXE Package size: 17 mm × 17 × 1.0 mm Type 4 SoC:Data sheet Intel DDR3L single-channel or LPDDR3 dual-channel memory controller supporting up to 4 GB; ECC supported in single-channel mode Display controller with 2 MIPI DSI ports and 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4a) Integrated Intel HD Graphics (Gen7) GPU One USB 3.0 controller supporting one USB 3.0 port (can be multiplexed to support four USB 2.0 ports) One USB 2.0 controller supporting four ports Integrated LPE audio controller Integrated image signal processor supporting two MIPI CSI ports, 24 MP sensors, and stereoscopic video Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC Serial I/O supporting SPI, UART (serial port), I2C or PWM Type 3 SoC: DDR3L/L-RS single-channel memory controller supporting up to 2 GB Display controller with 1 MIPI DSI port and 2 DDI ports (HDMI 1.4) Integrated Intel HD Graphics (Gen7) GPU One USB controller supporting two USB 2.0 ports Integrated LPE audio controller Integrated image signal processor supporting two MIPI CSI ports and 8 MP sensors Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC Serial I/O supporting SPI, UART (serial port), I2C or PWM

Airmont microarchitecture

"Cherry Trail-T" (14 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x2 (VT-x with EPT, FlexMigration, FlexPriority and VPIDVirtualization technology Intel AES-NI., TXT/TXE Package size: 17 mm × 17 × 1.0 mm Type 4 SoC: LPDDR3 dual-channel memory controller supporting up to 8 GB PCI Express 2.0 controller with 2 lanes Display controller with 2 MIPI DSI ports and 3 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4b) Integrated Intel HD Graphics (Gen8) GPU One USB xHCI controller supporting three USB 3.0 ports, two SSCI ports, and two HSIC ports One USB xDCI controller supporting one USB 3.0 port Integrated LPE audio controller Integrated image signal processor supporting three MIPI CSI ports and 13 MP ZLS sensors Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC Serial I/O supporting SPI, UART (serial port), I2C or PWM Type 3 SoC: DDR3L/L-RS single-channel memory controller supporting up to 2 GB PCI Express 2.0 controller with 1 lane Display controller with 2 MIPI DSI ports and 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4b) Integrated Intel HD Graphics (Gen8) GPU One USB controller supporting three USB 2.0 ports and two HSIC ports Integrated LPE audio controller Integrated image signal processor supporting three MIPI CSI ports and 8 MP sensors Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC Serial I/O supporting SPI, UART (serial port), I2C or PWM

Embedded processors/SoCs

Bonnell microarchitecture

"Tunnel Creek" (45 nm) CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), hyper-threading, Intel VT-x. Package size: 22 mm × 22 mm Steppings: B0 Temperature range: for (E620, E640, E660, E680): 0 °C to +70 °C, for (E620T, E640T, E660T, E680T): -40 °C to +85 °C. DDR2 single-channel memory controller supporting up to 2 GB PCI Express 1.0a controller with 4 lanes Display controller with LVDS and serial DVO ports Integrated GMA600 (PowerVR) GPU Integrated HD audio controller Serial I/O supporting SPI

"Stellarton" (45 nm) "Tunnel Creek" CPU with an Altera Field Programmable Gate Array (FPGA) CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Hyper-Threading, Intel VT-x Package size: 37.5 mm × 37.5 mm Steppings: B0 TDP without FPGA. Total package TDP depends on functions included in FPGA. Max. TDP 7 W. Temperature range: for (E625C, E645C, E665C): 0 °C to +70 °C, for (E625CT, E645CT, E665CT): -40 °C to +85 °C. DDR2 single-channel memory controller supporting up to 2 GB PCI Express 1.0a controller with 4 lanes Display controller with LVDS and serial DVO ports Integrated GMA600 (PowerVR) GPU Integrated HD audio controller Serial I/O supporting SPI

Silvermont microarchitecture

"Bay Trail-I" (22 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, TXT/TXE Package size: 25 mm × 27 mm DDR3L dual-channel memory controller supporting up to 4 GB; ECC supported in single-channel mode Display controller with 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4a) Integrated Intel HD Graphics (Gen7) GPU PCI Express 2.0 controller with four lanes and four root ports Two SATA-300 ports One USB 3.0 controller supporting one USB 3.0 port (can be multiplexed to support four USB 2.0 ports) One USB 2.0 controller supporting four ports Integrated LPE and HD audio controllers Integrated image signal processor supporting three MIPI CSI ports, 24 MP sensors, and stereoscopic video Integrated memory card reader supporting SDIO 3.0, eMMC 4.5, and SDXC Serial I/O supporting SPI, UART (serial port), I2C or PWM

Airmont microarchitecture