Intel is an American multinational corporation and technology company headquartered in Santa Clara, California. Processors are manufactured in semiconductor fabrication plants called "fabs" which are then sent to assembly and testing sites before delivery to customers. Intel has stated that approximately 75% of their semiconductor fabrication is performed in the United States.
Since May 1990, Intel has made an effort to eliminate chlorofluorocarbon consumption for the Oregon, Puerto Rico and Ireland system factories.Intel Corporation, "NewsBits: CFCs Eliminated From Intel Systems Manufacturing", Microcomputer Solutions, January/February 1992, page 1
Both Schumacher, a division of Air Products & Chemicals, and Intel developed chemical that reduce ozone emission using TRANS-LC or trans 1, 2-dichloroethylene to replace from TCA or 1,1,1-Trichloroethane to grow defect free silicon oxide surfaces.Intel Corporation, "NewsBit: Schumacher and Intel Develop "Ozone Friendly" Chemical", Microcomputer Solutions, September/October 1992, page 1
The Oregon Governor's Award for Toxics Use Reduction recognising Intel's Hillsboro facility achievement in reducing the use of toxic substance and generation of hazardous wastes.Intel Corporation, "NewsBits: Oregon Facility Wins Environmental Award", Microcomputer Solutions, November/December 1992, page 1
Current fab sites
Fab name Fab location Coordinates Production start year Process (wafer, node)AFO Aloha, Oregon, U.S.1976300mm, DevelopmentD1B Hillsboro, Oregon, U.S.1996300mm, DevelopmentRB1 Hillsboro, Oregon, U.S.2001300mm, DevelopmentD1C Hillsboro, Oregon, U.S.2001300mm, DevelopmentRP1 Hillsboro, Oregon, U.S.2001300mm, ResearchD1D Hillsboro, Oregon, U.S.2003300mm, DevelopmentD1X Hillsboro, Oregon, U.S.2013300mm, DevelopmentFab 10 Leixlip, Ireland1994Fab 11X Rio Rancho, New Mexico, U.S.1995 upgrade 2020/2021 with 22/14300mm, 45 nm/32 nm, PackagingFab 12 Chandler, Arizona, U.S.2006300mm, 22 nm/14 nm/10 nmFab 18 Kiryat Gat, IsraelFab 22 Chandler, Arizona, U.S.2002300mm, 22 nm/14 nm/10 nmFab 24 Leixlip, Ireland2006300mm, 14 nmFab 27 Licking County, Ohio, U.S.(2030–2032)300mm, 14AFab 28a Kiryat Gat, Israel1996300mm, 22 nmFab 28 Kiryat Gat, Israel(2023)300mm, 22nm/14nm/10nmFab 32 Chandler, Arizona, U.S.2007300mm, 22 nm/14 nm/10 nmFab 34 Leixlip, Ireland2023300mm, Intel 4 (previously node 7nm), Intel 3Intel Corporation, "Media Alert: Intel Starts High-Volume EUV Production in Ireland"Fab 38 Kiryat Gat, Israel(2024)300mm, 22 nmFab 42 Chandler, Arizona, U.S.2020300mm, 10 nm/5 nm (2024)Fab 52 Chandler, Arizona, U.S.2025300mm, 18AFab 62 Chandler, Arizona, U.S.(2026)300mmSC2 Santa Clara, California, U.S.Reticle/Masks, Intel Mask OperationsPelican Penang, Malaysia(2024)300mm, Packaging
Past fab sites Opened Closed NotesFab 1 Mountain View, California, U.S.19681981Formerly located at 365 East Middlefield Road.Fab 2 Santa Clara, California, U.S.19682009Located in building SC1, at the corner of Bowers Ave. and Central ExpresswayFab 1A Santa Clara, California, U.S.19801991Located on Mission College BoulevardFab 3 Livermore, California, U.S.1973Intel Corporation, "NewsBits: Intel Postpones Closure of Fabrication Plant", Microcomputer Solutions, September/October 1990, page 11991Plant began making wafers in April 1973. First plant outside of the Santa Clara area, and is where the famous Bunny Suits were first introduced. Located on North Mines Road.Fab 4 Aloha, Oregon, U.S.19761996 (decommissioned)2016 (demolished)First wafer manufacturing plant outside of Silicon Valley and first facility in what is now known as Oregon's Silicon Forest. Production began for 3-inch wafers.Fab 5 / D1 Aloha, Oregon, U.S.Previously a development facility, then production facility. Currently inactive. Intel original Pentium was made there.Ivey, Mark, "Building the Pentium Processor" Intel Corporation, Solutions, May/June 1993, page 4Fab 6 Chandler, Arizona, U.S.19802000First silicon wafer manufacturing facility in Arizona. Key architecture was the 286 microprocessor.Fab 7 Rio Rancho, New Mexico, U.S.198020022005 (converted to test facility)Production focused on flash memory chips. In June, 1993 they have started the production of 0.8-micron flash chips at this location.Intel Corporation, "News: Intel Ramps Flash Production at Three Factories", Intel Solutions, October 1993, page 3 Fourth-generation Flash products which was using the 0.6-micron process were made.Hodson, Gerri, "Fourth-Generation Flash", Intel Corporation, Intel Solutions, December 1993, page 10-14 By the time production stopped, plant was producing 0.35 micron-6 inch wafers. In 2005, $105 million was invested to temporarily turn Fab 7 into a testing facility.Fab 8 Jerusalem, Israel198520082009 (converted to die prep facility)First Fab outside of the United States. Ended production with, what was at the time, the last 6-inch wafer fab. Building was converted into die prep facility to support nearby Fab 28.Fab 9 Rio Rancho, New Mexico, U.S.1987Facility eventually expanded to merge with Fab 11 in 1999.D2 Santa Clara, California, U.S.1989Chen, Allen, "The Incredible Shrinking Transistor: Next Generation Processing at Intel", Intel Corporation, Microcomputer Solutions, September/October 1990, page 22009 (decommissioned)Development for these EPROM, Flash memory and microcontroller technology.Chen, Allen, "The Incredible Shrinking Transistor: Next Generation Processing at Intel", Intel Corporation, Microcomputer Solutions, September/October 1990, page 2 They expanded this location which was previously used for research and development. They were manufactured by using the eight-inch wafers. They have expanded up to 300,000 square foot complex and adding the 12,000 square feet of "Class-1" clean room bringing up to total of 37,000 square feet.Intel Corporation, "NewsBits: Intel Announces $400 Million Expansion", Microcomputer Solutions, November/December 1992, page 1 After being decommissioned, was converted into a data center.Fab 10 / IFOIntel Corporation, 30 years growing togetherIntel Corporation, "NewsBits: Intel Announces European Manufacturing Facility", Microcomputer Solutions, September/October 1990, page 1 Leixlip, Ireland1993PentiumFab 11 Rio Rancho, New Mexico, U.S.(Merged into F11X)Fab 14 Leixlip, Ireland19982009250nmFab 15 / D1A Aloha, Oregon, U.S.2003 (converted to assembly / test)Previously a development Fab named D1A before construction began on D1B in 1994.Fab 16 Ft. Worth, Texas, U.S.(never opened)2003 (canceled)Planned to open in Ft. Worth, Texas, in 1999, but was eventually canceled in 2003.Fab 17 Hudson, Massachusetts, U.S.1998 (acquired from DEC)2014Facility used older technology and closed (along with Fab 11X) because site was not large enough to accommodate a leading-edge fab. Made specialty products on the trailing edge of chip technology, and was last to make chips on 200-millimeter silicon wafers.Fab 20 / D1B, Hillsboro, Oregon, U.S.Fab 23 Colorado Springs, Colorado, U.S.2000 (acquired from Rockwell)2007Site originally purchased from Rockwell, but due to lack of demand and for financial reasons, Intel put it up for sale in 2007. It eventually sold in 2011 to the El Paso County government, who repurposed the offices.Fab 68 Dalian, Liaoning, China2010/201620213DNAND, 3DXPoint fab that was sold to SK Hynix
Assembly and test sites AFO, Aloha, Oregon, United States Chandler, Arizona, United States CD1, Chengdu, Sichuan, China CD6, Chengdu, Sichuan, China KMDSDP, Kulim, Malaysia SBDSDP, Sibu, Sarawak, Malaysia KKDSDP, Kota Kinabalu, Sabah, Malaysia KMO, Kulim, Malaysia KM5, Kulim, Malaysia PG8, Penang, Malaysia VNAT, Ho Chi Minh City, Vietnam Jerusalem, Israel CRAT, Heredia, Belén, Costa Rica (1997–2014; 2020 – present) Makati, Philippines – MN1-MN5 also known as A2/T11 (1974–2009) Cavite, Philippines – CV1-CV4 (1997–2009) Shanghai, China (former Assembly / Test Manufacturing) Las Piedras Puerto Rico 1991-2001 (assemble Pentium CPU/Motherboards)
See also List of semiconductor fabrication plants
External links Global Manufacturing at Intel
References